{"id":2401,"date":"2026-06-24T09:26:09","date_gmt":"2026-06-24T09:26:09","guid":{"rendered":"https:\/\/www.pickplace.de\/?post_type=glossary&#038;p=2401"},"modified":"2026-06-24T09:26:17","modified_gmt":"2026-06-24T09:26:17","slug":"pick-and-place","status":"publish","type":"glossary","link":"https:\/\/www.pickplace.de\/en\/glossar\/pick-and-place\/","title":{"rendered":"Pick and Place"},"content":{"rendered":"<p class=\"wp-block-paragraph\">Pick and place refers to in the <a href=\"https:\/\/www.pickplace.de\/en\/glossary\/ems\/\" data-type=\"glossary\" data-id=\"1385\">Electronics Manufacturing<\/a> the automated placement of components onto a printed circuit board. In SMT assembly, a pick-and-place machine places SMD components onto the designated pads of a printed circuit board, usually after solder paste has been applied there.<\/p>\n\n\n\n<div class=\"wp-block-rank-math-toc-block\" id=\"rank-math-toc\"><h2>Content<\/h2><nav><ul><li class=\"\"><a href=\"#was-bedeutet-pick-and-place\">Pick and place<\/a><\/li><li class=\"\"><a href=\"#wie-funktioniert-pick-and-place\">How does pick and place work?<\/a><\/li><li class=\"\"><a href=\"#wo-wird-pick-and-place-verwendet\">Where is pick and place used?<\/a><\/li><li class=\"\"><a href=\"#wichtige-eigenschaften\">Important Properties<\/a><\/li><li class=\"\"><a href=\"#abgrenzung-zu-verwandten-begriffen\">Demarcation from related terms<\/a><\/li><li class=\"\"><a href=\"#grenzen-und-typische-missverstandnisse\">Boundaries and typical misunderstandings<\/a><\/li><\/ul><\/nav><\/div>\n\n\n\n<h2 id=\"was-bedeutet-pick-and-place\" class=\"wp-block-heading\">Pick and place<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The term describes two consecutive work steps. First, a placement head picks up a component from a feeding system. Then, the machine places this component on the printed circuit board at the position specified in the placement program.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In PCB assembly, pick and place is primarily used for surface mount devices. This includes resistors, capacitors, integrated circuits, and other SMD designs. The board is transported, aligned, and held in place by the machine during assembly. Components are positioned using X and Y coordinates as well as their rotation.<\/p>\n\n\n\n<h2 id=\"wie-funktioniert-pick-and-place\" class=\"wp-block-heading\">How does pick and place work?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">One <a href=\"https:\/\/www.itechsmt.com\/de\/collections\/smt-pick-and-place-machine?srsltid=AfmBOopfFrEF4nVzqW5Qvf62a1H0yqU7t3b7L8eX0cgzU3rq5L7osuSz\" target=\"_blank\" rel=\"noopener\">Pick-and-place machine<\/a> works with a placement program. This program is based on PCB data, a bill of materials, and placement data. The placement data contains information about which component should be placed on the PCB at which position and in which orientation.<\/p>\n\n\n\n<div class=\"wp-block-stackable-image stk-block-image stk-block stk-475e417\" data-block-id=\"475e417\"><style>.stk-475e417 .stk-img-figcaption{text-align:center !important;font-style:italic !important;}.stk-475e417 .stk-img-wrapper{width:700px !important;}<\/style><figure><span class=\"stk-img-wrapper stk-image--shape-stretch\"><img loading=\"lazy\" decoding=\"async\" class=\"stk-img wp-image-2402\" src=\"https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/06\/image-7.png\" width=\"700\" height=\"700\" alt=\"iTECH Pick and Place \/ SMT Assembly Machine for Electronics Manufacturing \u2013 electronic manufacturing service, embedded hardware.\" srcset=\"https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/06\/image-7.png 700w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/06\/image-7-300x300.png 300w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/06\/image-7-150x150.png 150w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/06\/image-7-12x12.png 12w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\"\/><\/span><figcaption class=\"stk-img-figcaption\">Pick and Place \/ SMT Assembly Machine <a href=\"https:\/\/www.itechsmt.com\/products\/ppm-c400gs-automatic-smt-pick-and-place-machine-with-6-heads\" target=\"_blank\" rel=\"noopener\">iTECH <\/a><\/figcaption><\/figure><\/div>\n\n\n\n<p class=\"wp-block-paragraph\">Before assembly, components are loaded into feeding systems. Small SMD components are often on tape, which are inserted into feeders. Other components can be supplied in tubes or trays. The feeder makes the next component available at a defined pickup position.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The placement head moves to the pickup position, picks up the component, usually with a nozzle and vacuum, and transports it to the printed circuit board. During this path, a camera can capture the component from below. The machine checks the shape, position, and rotation of the picked-up component. If the component was slightly shifted or rotated during pickup, the machine can correct the placement accordingly.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The circuit board is aligned in the machine using optical marks. These marks are called fiducials. They are recognizable targets located on the circuit board or on the carrier. Using multiple fiducials, the machine can determine the position, rotation, and, if applicable, the distortion of the circuit board. Afterward, it places the components at the coordinates stored in the assembly program.<\/p>\n\n\n\n<h2 id=\"wo-wird-pick-and-place-verwendet\" class=\"wp-block-heading\">Where is pick and place used?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Pick and place is used in SMT component placement for printed circuit boards. The populated printed circuit boards are found in electronic assemblies for computers, consumer devices, industrial equipment, medical technology, vehicles, telecommunications, and other electronic products.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The process is part of a manufacturing chain. Before assembly, solder paste is printed onto the pads. Afterwards, a solder paste inspection can check if the paste deposits are present and correctly shaped. Subsequently, the pick-and-place machine places the SMD components into the solder paste. After assembly, reflow soldering usually follows, during which the solder paste melts and electrically and mechanically connects the components to the printed circuit board.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Pick-and-place systems are also used for designs that require other feeding methods or special tools. Large integrated circuits can come from trays. Components from tubes can be moved to the placement position via a feeding unit. For special housing shapes, a different placement head or a different nozzle may be required.<\/p>\n\n\n\n<h2 id=\"wichtige-eigenschaften\" class=\"wp-block-heading\">Important Properties<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A pick-and-place machine consists of several functional groups. These include feeder systems, placement heads, nozzles, cameras, axis systems, PCB transport, and software for program execution.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The feeder determines how components are made available. Belt feeders transport components step-by-step to the removal point. Tube feeders bring components forward from a tube. Trays hold larger or more sensitive components in fixed positions.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The placement head determines which components can be picked. A single head can handle different shapes or heavier components, but picks up fewer components per cycle. Multiple heads can pick up and place multiple components in one pass. The selection of the head depends on component shape, weight, and required handling.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The camera system performs two tasks. It recognizes the circuit board via fiducials and captures the component after placement. Image processing can verify if the component is present, if it was placed correctly, and if its position needs to be corrected. On some machines, electrical properties such as resistance, capacitance, or inductance can also be measured during the process. Such checks extend the cycle time but can detect incorrect components or feeding errors.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The software connects component data with machine movements. It determines which feeder contains which component, which head is used, and the sequence in which placements occur. Machines can write logs during assembly, such as assembly time, pickup errors, placement errors, head usage, and machine messages.<\/p>\n\n\n\n<h2 id=\"abgrenzung-zu-verwandten-begriffen\" class=\"wp-block-heading\">Demarcation from related terms<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Pick and Place is not synonymous with the entire PCBA. The term describes the assembly step where components are picked up and placed. Solder paste printing, solder paste inspection, reflow soldering, X-ray inspection, THT assembly, and manual soldering are separate process steps.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">SMT refers to the surface mounting of components on printed circuit boards. Pick and Place is a process within this SMT process. SMD refers to the components designed for surface mounting.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">THT assembly differs from this because component leads are guided through holes in the printed circuit board. Different assembly and soldering processes exist for such components. Although automated insertion machines also exist, they operate with different mechanical requirements than SMT pick-and-place systems.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">A component placer is often a pick-and-place machine when it comes to SMT components. However, the more general term can also include other assembly automation solutions.<\/p>\n\n\n\n<h2 id=\"grenzen-und-typische-missverstandnisse\" class=\"wp-block-heading\">Boundaries and typical misunderstandings<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A pick-and-place machine can only process components if the feeder, nozzle, head, camera data, and placement program match the component. Small lead pitches may require individual inspection.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Special components may require special tools. Examples include LEDs with lenses, special connectors, edge connectors, or MELF components. For prototypes, manual placement of such components may be more sensible if setup or tooling causes more effort than the actual assembly.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Another misunderstanding concerns component feeding. Components must be available in sufficient quantities and in the appropriate format. For strip material, a minimum length may be necessary for the feeder to grip and advance the strip. Additionally, spare parts are required because individual components may be rejected during setup, testing, or after a fault.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Errors don't just occur during placement. The machine can pick up a component incorrectly, lose it due to improper vacuum, or fail to identify it because of a camera image. Incorrectly selected pick-up heads, unrecognized fiducials, or blocked feeders can also halt the process. Rejected components are placed into a reject bin if the machine cannot identify or handle them reliably.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The achievable placement performance is not a fixed characteristic of the term \"pick and place.\" It depends on machine configuration, head count, component sizes, inspections, travel distances, and product mix. Machines with multiple heads or multiple gantries can process more components per unit of time than systems with a single head. Conversely, additional inspections or difficult components extend the process.<\/p>","protected":false},"excerpt":{"rendered":"<p>Pick and Place bezeichnet in der Elektronikfertigung das automatisierte Aufnehmen und Platzieren von Bauteilen auf einer Leiterplatte. Bei der SMT-Best\u00fcckung setzt eine Pick-and-Place-Maschine SMD-Bauteile auf die vorgesehenen Pads einer Leiterplatte, meist nachdem dort Lotpaste aufgetragen wurde. Was bedeutet Pick and Place? Der Begriff beschreibt zwei aufeinanderfolgende Arbeitsschritte. Zuerst nimmt ein Best\u00fcckkopf ein Bauteil aus einem [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"menu_order":0,"template":"","meta":{"footnotes":""},"class_list":["post-2401","glossary","type-glossary","status-publish","hentry"],"blocksy_meta":[],"_links":{"self":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/glossary\/2401","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/glossary"}],"about":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/types\/glossary"}],"author":[{"embeddable":true,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/users\/1"}],"version-history":[{"count":1,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/glossary\/2401\/revisions"}],"predecessor-version":[{"id":2404,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/glossary\/2401\/revisions\/2404"}],"wp:attachment":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/media?parent=2401"}],"curies":[{"name":"WP","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}