{"id":1083,"date":"2025-12-19T20:06:01","date_gmt":"2025-12-19T20:06:01","guid":{"rendered":"https:\/\/pickplace.de\/?p=1083"},"modified":"2026-05-22T12:40:33","modified_gmt":"2026-05-22T12:40:33","slug":"emv-issues-with-industrial-printed-circuit-boards","status":"publish","type":"post","link":"https:\/\/www.pickplace.de\/en\/emv-probleme-bei-industriellen-leiterkarten\/","title":{"rendered":"EMV problems with industrial printed circuit boards"},"content":{"rendered":"<div class=\"wp-block-stackable-text stk-block-text stk-block stk-26880f3\" data-block-id=\"26880f3\"><p class=\"stk-block-text__text\">EMC is rarely the primary topic at the beginning of a development project. EMC problems are insidious and only arise long after the initial development iterations. In the early stages, functionality, component selection, and PCB layout are the main focus. However, if EMC requirements are not systematically considered from the outset, the costs for troubleshooting will significantly increase later in the project. <\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-de8b7d9\" data-block-id=\"de8b7d9\"><p class=\"stk-block-text__text\">In the concept and design phase, EMC aspects can usually be considered with little effort: through appropriate topologies, suitable components, sensible partitioning of the circuit, and basic layout rules. Adjustments in this phase cause hardly any additional costs, as they are part of the normal development work. Important in the <a href=\"https:\/\/www.pickplace.de\/en\/hardware-development\/\" data-type=\"page\" data-id=\"865\">Hardware Development<\/a> is therefore above all the knowledge of the most important and pressing problems of EMC.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-columns stk-block-columns stk-block stk-3284793\" data-block-id=\"3284793\"><div class=\"stk-row stk-inner-blocks stk-block-content stk-content-align stk-3284793-column\">\n<div class=\"wp-block-stackable-column stk-block-column stk-column stk-block stk-84d3d88\" data-v=\"4\" data-block-id=\"84d3d88\"><div class=\"stk-column-wrapper stk-block-column__content stk-container stk-84d3d88-container stk--no-background stk--no-padding\"><div class=\"stk-block-content stk-inner-blocks stk-84d3d88-inner-blocks\">\n<div class=\"wp-block-stackable-image stk-block-image stk-block stk-6570889\" data-block-id=\"6570889\"><style>.stk-6570889 .stk-img-figcaption{text-align:center !important;color:var(--theme-palette-color-1, #EE4B6A) !important;font-style:italic !important;}<\/style><figure><span class=\"stk-img-wrapper stk-image--shape-stretch\"><img loading=\"lazy\" decoding=\"async\" class=\"stk-img wp-image-1084\" src=\"https:\/\/pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-kosten.webp\" width=\"1008\" height=\"474\" alt=\"EMV problems are significantly driving up development costs\" srcset=\"https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-kosten.webp 1008w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-kosten-300x141.webp 300w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-kosten-768x361.webp 768w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-kosten-18x8.webp 18w\" sizes=\"auto, (max-width: 1008px) 100vw, 1008px\"\/><\/span><figcaption class=\"has-text-color stk-img-figcaption\">EMV problems are significantly driving up development costs<\/figcaption><\/figure><\/div>\n<\/div><\/div><\/div>\n<\/div><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-e435f71\" data-block-id=\"e435f71\"><p class=\"stk-block-text__text\">After the initial hardware build, the conditions change drastically. If EMC problems only appear after the PCB assembly or during preliminary tests and certification tests, corrections become significantly more complex. Layout changes, additional filters, shielding measures, or even a PCB redesign incur direct costs for development, new prototypes, and re-testing. Added to this are indirect costs due to delays and blocked resources.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-d10de9f\" data-block-id=\"d10de9f\"><p class=\"stk-block-text__text\">It becomes particularly critical when EMC problems are only detected in late phases such as design verification, validation, or just before product release. At this stage, EMC deficiencies often lead to multiple hardware revision iterations, delays in market launch, or, in extreme cases, project cancellations. The costs do not increase linearly, but exponentially with each later phase.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-a5a7168\" id=\"die-haufigsten-emv-probleme-beim-leiterplatten-design\" data-block-id=\"a5a7168\"><h2 class=\"stk-block-heading__text\">The most common EMC problems in PCB design<\/h2><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-8d742fa\" data-block-id=\"8d742fa\"><p class=\"stk-block-text__text\">EMV problems arise from specific physical effects on the printed circuit board and connected lines. The causes are rapid changes in current and voltage, parasitic inductances and capacitances, as well as unfavorable return paths. Certain interference sources repeatedly occur and can be observed independently of the application or device category.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-image stk-block-image stk-block stk-d635ec2\" data-block-id=\"d635ec2\"><style>.stk-d635ec2 .stk-img-figcaption{text-align:center !important;color:var(--theme-palette-color-1, #EE4B6A) !important;font-style:italic !important;}<\/style><figure><span class=\"stk-img-wrapper stk-image--shape-stretch\"><img loading=\"lazy\" decoding=\"async\" class=\"stk-img wp-image-1085\" src=\"https:\/\/pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-scaled.png\" width=\"2560\" height=\"974\" srcset=\"https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-scaled.png 2560w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-300x114.png 300w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-1024x390.png 1024w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-768x292.png 768w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-1536x585.png 1536w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-2048x779.png 2048w, https:\/\/www.pickplace.de\/wp-content\/uploads\/2026\/02\/emv-probleme-leiterplatte-modell-1-18x7.png 18w\" sizes=\"auto, (max-width: 2560px) 100vw, 2560px\"\/><\/span><figcaption class=\"has-text-color stk-img-figcaption\"><em>Standard model of an industrial printed circuit board with EMC influences<\/em><\/figcaption><\/figure><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-5f9c8b0\" id=\"ic-switching-noise\" data-block-id=\"5f9c8b0\"><h3 class=\"stk-block-heading__text\">IC Switching Noise<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-48657ae\" data-block-id=\"48657ae\"><p class=\"stk-block-text__text\">When switching internal logic structures, very rapid current changes occur. These high di\/dt values generate broadband interference that is directly fed into supply and ground connections. IC switching noise is often the origin of many other EMC effects, as it can propagate throughout the entire printed circuit board.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-38e8ff6\" id=\"transienten-in-der-versorgungsspannung\" data-block-id=\"38e8ff6\"><h3 class=\"stk-block-heading__text\">Transients in the supply voltage<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-3f141b0\" data-block-id=\"3f141b0\"><p class=\"stk-block-text__text\">Due to parasitic inductances in traces, vias, and bond connections, the supply voltage reacts sensitively to rapid load changes. The result is temporary voltage drops or overshoots on Vcc. These Vcc transients influence the switching behavior of the ICs and increase the high-frequency component of the emissions.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-ce6e7b4\" id=\"storungen-und-einflusse-von-nbsp-clock-signalen\" data-block-id=\"ce6e7b4\"><h3 class=\"stk-block-heading__text\">Disturbances and Influences of Clock Signals<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-bc99736\" data-block-id=\"bc99736\"><p class=\"stk-block-text__text\">Clock signals have steep edges and therefore a broad spectrum of harmonics. Even at comparatively low fundamental frequencies, clock signal lines can cause significant electromagnetic interference. Long lines, missing reference planes, or missing damping significantly amplify this effect.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-3274b7c\" id=\"ringing-und-uberschwingen-durch-impedanzsprunge\" data-block-id=\"3274b7c\"><h3 class=\"stk-block-heading__text\">Ringing and Overshoot Due to Impedance Mismatches<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-dd24985\" data-block-id=\"dd24985\"><p class=\"stk-block-text__text\">Ringing occurs when the line impedance does not match the driver or receiver. Reflections cause overshoot and undershoot on the signal edges, which significantly increases the high-frequency content of the signal. These additional frequency components directly and negatively impact EMC behavior.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-6bafc67\" id=\"crosstalk-nbsp-zwischen-leiterbahnen\" data-block-id=\"6bafc67\"><h3 class=\"stk-block-heading__text\">Crosstalk between traces<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-000e2ec\" data-block-id=\"000e2ec\"><p class=\"stk-block-text__text\">In dense routing, signals capacitively and inductively couple into adjacent traces. Crosstalk manifests as interference pulses on otherwise quiet signals. This is particularly critical for parallel routing of fast signals without sufficient spacing or missing reference planes. There are now analysis tools for the effects of crosstalk, for example in the form of <a href=\"https:\/\/resources.altium.com\/de\/p\/high-speed-pcb-design-analysis-simulations-and-signal-integrity-checks\" target=\"_blank\" rel=\"noopener\">Signal integrity testing<\/a>.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-f27465f\" id=\"abstrahlung-durch-die-leiterplatte\" data-block-id=\"f27465f\"><h3 class=\"stk-block-heading__text\">Printed circuit board radiation<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-b4a7e40\" data-block-id=\"b4a7e40\"><p class=\"stk-block-text__text\">The printed circuit board can act as an antenna. Large current loops, interrupted mass surfaces, or resonant copper structures cause high-frequency disturbances to be radiated directly from the PCB. PCB radiation is often a consequence of unfavorable return paths and lack of surface continuity.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-161cff7\" id=\"abstrahlung-an-ein-und-ausgangen\" data-block-id=\"161cff7\"><h3 class=\"stk-block-heading__text\">Radiation at inputs and outputs<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-subtitle stk-block-subtitle stk-block stk-56ba357\" id=\"i-o-pins-stellen-eine-direkte-kopplung-zwischen-internen-schaltvorgangen-und-der-aussenwelt-dar-schnelle-signalwechsel-an-diesen-pins-fuhren-zu-lokaler-abstrahlung-ohne-dampfung-oder-filterung-kann-sich-i-o-radiation-schnell-zu-einem-dominanten-emv-problem-entwickeln\" data-block-id=\"56ba357\"><p class=\"stk-block-subtitle__text stk-subtitle\">I\/O pins represent a direct coupling between internal switching operations and the outside world. Rapid signal changes at these pins lead to local radiation. Without damping or filtering, I\/O radiation can quickly develop into a dominant EMC problem.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-10995da\" id=\"kabel-nbsp-als-sendeantennen\" data-block-id=\"10995da\"><h3 class=\"stk-block-heading__text\">Cables as transmitting antennas<\/h3><\/div>\n\n\n\n<div class=\"wp-block-stackable-text stk-block-text stk-block stk-7b63e07\" data-block-id=\"7b63e07\"><p class=\"stk-block-text__text\">Connected cables act as very efficient antennas. Common-mode noise that enters the cable from the PCB is radiated with high efficacy. Cable radiation is one of the most common reasons for failing EMC tests, even when the PCB alone appears inconspicuous.<\/p><\/div>\n\n\n\n<div class=\"wp-block-stackable-heading stk-block-heading stk-block-heading--v2 stk-block stk-67e9e72\" id=\"fazit\" data-block-id=\"67e9e72\"><h2 class=\"stk-block-heading__text\">Conclusion<\/h2><\/div>\n\n\n\n<div class=\"wp-block-stackable-subtitle stk-block-subtitle stk-block stk-207cb2b\" data-block-id=\"207cb2b\"><p class=\"stk-block-subtitle__text stk-subtitle\">Most EMC problems can be traced back to a few clearly identifiable sources of interference. The key factor is not a single effect, but rather the interaction between IC switching noise, Vcc transients, and disturbed signals, as well as the resulting radiation via the PCB, I\/Os, and cables. Understanding these relationships allows one to identify EMC problems early on and take targeted measures to prevent them.<\/p><\/div>","protected":false},"excerpt":{"rendered":"<p>EMV ist selten das prim\u00e4re Thema zu Beginn eines Entwicklungsprojekts. EMV-Probleme sind t\u00fcckisch und treten erst lange nach den ersten Entwicklungsiterationen auf. In fr\u00fchen Phasen stehen hingegen Funktion, Bauteilauswahl und PCB-Layout im Vordergrund. Werden EMV-Anforderungen jedoch nicht von Anfang an systematisch ber\u00fccksichtigt, steigen die Kosten zur Fehlerbehebung im sp\u00e4teren Projektverlauf deutlich an. In der Konzept- [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":1086,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[26,25],"tags":[24],"class_list":["post-1083","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-hardware-entwicklung","category-emv","tag-emv-probleme-bei-industriellen-leiterkarten"],"_links":{"self":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/posts\/1083","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/comments?post=1083"}],"version-history":[{"count":3,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/posts\/1083\/revisions"}],"predecessor-version":[{"id":2240,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/posts\/1083\/revisions\/2240"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/media\/1086"}],"wp:attachment":[{"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/media?parent=1083"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/categories?post=1083"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.pickplace.de\/en\/wp-json\/wp\/v2\/tags?post=1083"}],"curies":[{"name":"WP","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}